A leading technology company in Boston is looking for a Lead Package Assembly Integrator to drive innovations in advanced packaging technologies. In this role, your tasks involve developing test chip strategies and analyzing assembly processes for high-performance AI architectures. The ideal candidate will have a relevant advanced degree and substantial experience in wafer scale packaging development. You’ll have the opportunity to work in a flexible workplace and contribute to cutting-edge projects in the AI field.#J-18808-Ljbffr